August 31, 2026 – Hong Kong – The tender for the two sets of land parcels in Phase 1 of the Hong Kong-Shenzhen Innovation and Technology Park (“Loop Hong Kong Park”) closed at noon today (August 31). Hong Kong-Shenzhen Innovation and Technology Park Limited (“Loop Hong Kong Park Company”) has received a total of six tenders.
This is the inaugural land tender of the Loop Hong Kong Park. Two sets of land parcels (involving a total of four parcels) were tendered, each comprising one parcel designated for innovation and technology (“I&T”) use, while tenderers had the option to tender for one parcel designated for talent accommodation.
The six tenders received hail from a diverse range of enterprises, including high-end I&T industries and large conglomerates that align precisely with the Loop Hong Kong Park’s development needs. The enthusiastic response to this inaugural tender demonstrates the industry’s full recognition of Hong Kong’s strengths in I&T, as well as its confidence and high expectations for the I&T development of the Loop Hong Kong Park.
The tender adopted a “two-envelope approach,” with technical proposals and financial offers accounting for 70% and 30% of the total score, respectively. This approach encourages tenderers to respond to the Loop Hong Kong Park’s needs with more forward-looking technical and operational solutions, align with the Loop Hong Kong Park’s positioning, foster connections between scientific research and industrial development, and drive the comprehensive development of the upstream, midstream and downstream industrial chains in the Loop Hong Kong Park. The Loop Hong Kong Park Company will assess the tenders in accordance with the marking scheme in the tender documents with the aim of awarding the tenders within this year.
To accelerate the development of I&T land parcels, the Loop Hong Kong Park Company launched on July 24, 2026 the tender for three additional I&T parcels, as well as one parcel designated for talent accommodation, with a submission deadline of 12:00 p.m. on October 20, 2026. Tender details, submission methods and timeline are specified in the tender documents and relevant announcements. For further details, please visit https://www.hsitp.org/en/tender-notices
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