24 July 2026 – Hong Kong – Following the inaugural public tender for four land parcels in June, Hong Kong-Shenzhen Innovation and Technology Park Limited (“HSITPL”) today launched a public tender for four additional land parcels, further harnessing private-sector market forces to accelerate the development of the Hong Kong-Shenzhen Innovation and Technology Park ("HSITP").
The newly tendered land parcels comprise three innovation and technology (“I&T”) parcels, which can be developed into laboratories and offices, and one parcel designated for talent accommodation. The public-private partnership development model will continue to be adopted, under which successful tenderers will be responsible for the design, construction, financing, and management of the respective site(s).
Mr. Vincent Ma, Chief Executive Officer of HSITPL, stated: “Following last month's first public tender for Phase 1 land parcels, we are advancing with a second round of tenders just over a month later, allowing the market to assess and plan ahead, effectively shortening the transition period between the development of individual land parcels, and deepening synergies with the first-round tender. This fully reflects our determination to press ahead with HSITP’s development at full speed, seizing every moment. This tender will continue to adopt the ‘two-envelope system’, with a weighting of 70% for technical proposals and 30% for financial offers, aiming to attract high-quality enterprises specialising in frontier and advanced technologies, with strong execution capabilities and a long-term development vision.”
The first three buildings in Phase 1, Batch 1 of HSITP have been completed, with two wet-lab buildings fully leased. Construction of the remaining five buildings is significantly ahead of schedule, with completion targeted progressively within this year. Building 1 has topped out and façade works are under way, with a pre-leasing rate of over 70%, reflecting sustained market demand for I&T premises at HSITP.
Since its official opening late last year, more than 100 technology enterprises have signed agreements to establish a presence at HSITP. These include local, Mainland, and overseas enterprises, comprising listed companies, industry leaders, and startups.
The closing date for this public tender submission is noon on 20 October 2026. Details of the tender, submission methods, and schedule will be specified in the tender documents and related announcements.
For more information, please visit https://www.hsitp.org/en/tender-notices.