TENDER NOTICES

COMMERCIAL LETTING
Vending Machine Licensing Arrangements (subject to review from time to time)

Hong Kong-Shenzhen Innovation and Technology Park Limited is now inviting qualified vendors to express your interest for installation, operation and maintenance of vending machines for various products, including but not limited to soft drinks, juice, snacks, cooked food and daily care products at different designated locations at the Hong Kong-Shenzhen Innovation and Technology Park (“HSITP”).

 

Interested parties are required to submit the completed Reply Slip (Annex I) to formally declare such interest via leasing@hsitp.org.


Should you have any queries, please contact Ms. Cici Tse and Mr. Arnold Tang at cici.tse@hsitp.org and arnold.tang@hsitp.org for details of the licensing arrangements.


Details & Information of HSITP can be obtained via our website at https://www.hsitp.org.

PROCUREMENT

General Terms and Conditions for Purchase Orders (applicable to General Goods and Services)

 

The “Purchase Order Terms and Conditions”, accessible via the following link, shall apply unless stated otherwise in the Tender document.

 

Purchase Order Terms and Conditions

Tender Title & Number

Subject

Invitation Published Date 

 

Invitation Closing Date 

IT Support Services for HSITPL

Tender Number: FD-03-06-02(104)

The “Invitation Letter for Expression of Interest (EOI) Proposal” and “EOI documents” shall apply unless stated otherwise in the Tender document

23 April 2025 (Wednesday)

By 12:00 noon on 29 April 2025 (Tuesday)

AWARD OF CONTRACT

 

Contract No. 

Contract Title

Award Date

Contractor

WC/008

Excavation and Lateral Support Works for Batches 1B and 1C Development of Hong Kong-Shenzhen Innovation and Technology Park

12 Mar 2025 (Wed)

Bachy Soletanche Group Limited

WC/007

Main Works for Building 1 Development of Hong Kong-Shenzhen Innovation and Technology Park

13 Mar 2025 (Thu)

Hip Hing Engineering Company Limited

CA/031

Consultancy Services for Unmanned Aerial Vehicle Site Survey for Batch 1 Development

20 Mar 2025 (Thu)

GeoSys Hong Kong Limited